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PC123J00000F Series
PC123J00000F Series
DIP 4pin Reinforced Insulation Type Photocoupler
Description
PC123J00000F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. CTR is 50% to 400% at input current of 5mA.
Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC123) 2. Approved by BSI, BS-EN60065, file No. 7087, BSEN60950 file No. 7409, (as model No. PC123) 3. Approved by SEMKO, EN60065, EN60950, (as model No. PC123) 4. Approved by DEMKO, EN60065, EN60950 (as model No. PC123) 5. Approved by NEMKO, EN60065, EN60950, (as model No. PC123) 6. Approved by FIMKO, EN60065, EN60950, (as model No. PC123) 7. Recognized by CSA file No. CA95323 (as model No. PC123) 8. Approved by VDE (DIN EN60747-5-2()) (as an option), file No. 40008087 (as model No. PC123) 9. Package resin : UL flammability grade (94V - 0)
()
Features
1. 4-pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V) 4. Several CTR ranks available 5. Reinforced insulation type (Isolation distance : MIN. 0.4mm) 6. Long creepage distance type (wide lead-form type only : MIN. 8mm) 7. High isolation voltage between input and output (Viso(rms) : 5.0 kV) 8. Lead-free and RoHS directive compliant
DIN EN60747-5-2 : successor standard of DIN VDE0884
Applications
1. I/O isolation for MCUs (Micro Controller Units) 2. Noise suppression in switching circuits 3. Signal transmission between circuits of different potentials and impedances 4. Over voltage detection
Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A02904EN Date Sep. 1. 2006 (c) SHARP Corporation
PC123J00000F Series Internal Connection Diagram
1 4 1 2 3 2 3 4
Anode Cathode Emitter Collector
Outline Dimensions
1. Through-Hole [ex. PC123J00000F]
Anode mark 1.20.3 0.60.2
Rank mark Factory identification mark Date code Rank mark Factory identification mark Date code
1 4
(Unit : mm) 2. Through-Hole (VDE option) [ex. PC123YJ0000F]
Anode mark 1.20.3 0.60.2
1
4
4.580.30
PC123
2 3
PC123
2
4
6.50.3
3
6.50.3
2.540.25
2.540.25
4.580.30
SHARP mark "S" VDE idenfication mark
7.620.30
4.580.30 0.5TYP. 3.50.5
7.620.30
4.580.30 0.5TYP. 3.5 3.50.5
3.00.5
0.5
Epoxy resin 0.260.10 : 0 to 13
2.7
0.260.10 : 0 to 13
2.7
0.5
Epoxy resin
0.50.1
0.50.1
Product mass : approx. 0.23g 3. Wide Through-Hole Lead-Form [ex. PC123FJ0000F]
0.25
Product mass : approx. 0.23g 4. Wide Through-Hole Lead-Form (VDE option) [ex. PC123FYJ000F]
0.25
Rank mark Anode mark
0.3 0.2
Factory identification mark
0.3
Rank mark Anode mark
Factory identification mark
2.54
1.2
1.2
0.6
0.6
1
4
1
4
2.54
0.2
Date code
Date code
4
0.1 0.30 0.1
1.0
1.0
SHARP mark "S"
4.58
6.50.3 7.62
0.30
6.50.3 7.62
0.30
VDE idenfication mark
4.58
2
PC123
3
2
PC123
3
0.30
4.58
0.30
4.58
0.30
3.5
0.5
2.7MIN.
2.7MIN.
Epoxy resin 0.26 10.16
0.50 0.10
Epoxy resin 0.26
0.10
0.5
0.1
10.16
0.50
0.5
0.1
Product mass : approx. 0.23g
Product mass : approx. 0.23g
Sheet No.: D2-A02904EN
2
0.5
3.00.5
PC123J00000F Series
(Unit : mm) 5. SMT Gullwing Lead-Form [ex. PC123PJ0000F]
Rank mark Anode mark Factory identification mark
6. SMT Gullwing Lead-Form (VDE option) [ex. PC123PYJ000F]
Rank mark Anode mark Factory identification mark Date code
1
4
2.540.25
1.20.3
1.20.3
0.60.2
1
4
0.60.2
Date code
2.540.25 4.580.30
4.580.30
2
PC123
6.50.3
3
2
PC123 4
0.3
3
SHARP mark "S"
6.5 7.620.30 0.260.10 0.350.25 4.580.30
VDE idenfication mark
7.620.30 3.50.5 0.350.25
0.10
4.580.30 3.50.5 1.0+0.4 -0.0 2.540.25
Date code
4 3
1.0+0.4 -0.0
Epoxy resin 10.0+0.0 -0.5
1.0+0.4 -0.0
2.540.25 1.0+0.4 -0.0 Epoxy resin 10.0+0.0 -0.5
Product mass : approx. 0.22g 7. Wide SMT Gullwing Lead-Form [ex. PC123FPJ000F]
Rank mark
Product mass : approx. 0.22g 8. Wide SMT Gullwing Lead-Form (VDE option) [ex. PC123ZYJ000F]
Rank mark
Anode mark 1.20.3 0.60.2
Factory identification mark
0.26
Anode mark 1.20.3 0.6
0.2
Factory identification mark
Date code
1 4
1
4.580.30
2
PC123
6.50.3
3
2
PC123 4
0.3
1.00.1
0.1
2.540.25
1.0
6.5
0.260.10
0.25
3.50.5
2.540.25
7.620.30
4.580.30
4.580.30
SHARP mark "S" VDE idenfication mark
0.25
7.620.30 0.250.25 0.260.10
4.580.30 3.50.5 0.50.1 0.75
0.25
Epoxy resin 0.75
0.25
0.50.1 0.75
0.25
10.16
0.50
12.0MAX 0.75
0.25
Epoxy resin 10.16
0.50
12.0MAX
Product mass : approx. 0.22g
Product mass : approx. 0.22g
Sheet No.: D2-A02904EN
3
PC123J00000F Series Date code (2 digit)
1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M * * N * 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D
A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001
Mark P R S T U V W X A B C * * *
repeats in a 20 year cycle
Factory identification mark and Plating material
Factory identification Mark no mark Japan Indonesia or China SnCu (Cu : TYP. 2%)
* Up to Date code "T4" (April 2005), SnBi (Bi : TYP. 2%). ** This factory making is for identification purpose only. Please contact the local SHARP sales representative to see the actual status of the production.
Country of origin
Plating material SnCu (Cu : TYP. 2%) SnBi (Bi : TYP. 2%) SnCu (Cu : TYP. 2%)*
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A02904EN
4
PC123J00000F Series
Absolute Maximum Ratings
Parameter Symbol Forward current IF *1 Peak forward current IFM Reverse voltage VR Power dissipation P Collector-emitter voltage VCEO Emitter-collector voltage VECO IC Collector current Collector power dissipation PC Ptot Total power dissipation *2 Isolation voltage Viso (rms) Topr Operating temperature Tstg Storage temperature *3 Soldering temperature Tsol Rating 50 1 6 70 70 6 50 150 200 5.0 -30 to +100 -55 to +125 260 (Ta=25C) Unit mA A V mW V V mA mW mW kV C C C
*1 Pulse width100s, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f = 60Hz *3 For 10s
Electro-optical Characteristics
Parameter Symbol Forward voltage VF IR Reverse current Terminal capacitance Ct Collector dark current ICEO Collector-emitter breakdown voltage BVCEO Emitter-collector breakdown voltage BVECO Collector current IC Collector-emitter saturation voltage VCE (sat) Isolation resistance RISO Cf Floating capacitance fc Cut-off frequency tr Rise time Response time tf Fall time
Conditions IF=20mA VR=4V V=0, f=1kHz VCE=50V, IF=0 IC=0.1mA, IF=0 IE=10A, IF=0 IF=5mA, VCE=5V IF=20mA, IC=1mA DC500V, 40 to 60%RH V=0, f=1MHz VCE=5V, IC=2mA, RL=100, -3dB
Output
Input
Input
Output
Transfer characteristics
VCE=2V, IC=2mA, RL=100
MIN. - - - - 70 6 2.5 - 5x1010 - - - -
TYP. 1.2 - 30 - - - - 0.1 1x1011 0.6 80 4 3
MAX. 1.4 10 250 100 - - 20 0.2 - 1.0 - 18 18
(Ta=25C) Unit V A pF nA V nA mA V pF kHz s s
Sheet No.: D2-A02904EN
5
PC123J00000F Series
Model Line-up
Lead Form Package DIN EN60747-5-2 ------ PC123J00000F PC123AJ0000F PC123BJ0000F PC123CJ0000F PC123SJ0000F Through-Hole Wide Through-Hole Sleeve IC [mA] Rank mark (IF=5mA, VCE=5V, Ta=25C) 100pcs/sleeve Approved ------ Approved PC123FJ0000F PC123FYJ000F with or without 2.5 to 20.0 PC123YJ0000F A PC123F1J000F PC123FY1J00F PC123Y1J000F 2.5 to 7.5 B PC123F2J000F PC123FY2J00F PC123Y2J000F 5.0 to 12.5 No mark PC123F5J000F PC123FY5J00F PC123Y5J000F 10.0 to 20.0 S PC123YSJ000F PC123FSJ000F PC123FY8J00F 5.0 to 10.0
Model No.
Lead Form Package DIN EN60747-5-2
SMT Gullwing
Model No.
------ PC123PJ0000F PC123P1J000F PC123P2J000F PC123P5J000F PC123PSJ000F
Wide SMT Gullwing Taping IC [mA] Rank mark (IF=5mA, VCE=5V, Ta=25C) 2 000pcs/reel Approved ------ Approved PC123PYJ000F PC123FPJ000F PC123ZYJ000F with or without 2.5 to 20.0 A PC123PY1J00F PC123FP1J00F PC123ZY1J00F 2.5 to 7.5 B 5.0 to 12.5 PC123PY2J00F PC123FP2J00F PC123ZY2J00F No mark 10.0 to 20.0 PC123PY5J00F PC123FP5J00F PC123ZY5J00F S 5.0 to 10.0 PC123PY8J00F PC123FP8J00F PC123ZY8J00F
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A02904EN
6
PC123J00000F Series Fig.1 Forward Current vs. Ambient Temperature
50
Diode power dissipation P (mW)
Fig.2 Diode Power Dissipation vs. Ambient Temperature
100
Forward current IF (mA)
40
80 70 60
30
20
40
10 0 -30
20 0 -30
0
25
50 55
75
100
125
0
25
50 55
75
100
125
Ambient temperature Ta (C)
Ambient temperature Ta (C)
Fig.3 Collector Power Dissipation vs. Ambient Temperature
250 Collector power dissipation PC (mW)
Fig.4 Total Power Dissipation vs. Ambient Temperature
250
Total Power dissipation Ptot (mW)
200
200
150
150
100
100
50
50
0 -30
0
25
50
75
100
125
0 -30
0
25
50
75
100
125
Ambient temperature Ta (C)
Ambient temperature Ta (C)
Fig.5 Peak Forward Current vs. Duty Ratio
10 000 Pulse width100s Ta=25C Peak forward current IFM (mA)
Fig.6 Forward Current vs. Forward Voltage
Ta=75C 50C 25C 0C -25C
1 000
Forward current IF (mA)
10-3 10-2 Duty ratio 10-1 1
100
10
100
10
1
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Forward voltage VF (V)
Sheet No.: D2-A02904EN
7
PC123J00000F Series Fig.7 Current Transfer Ratio vs. Forward Current
300 VCE=5V Ta=25C 250 Current transfer ratio CTR (%) Collector current IC (mA) 60 54 48 42 36 30 24 18 12 6 0 0.1 0 1 10 100 0 1 2 3 4 5 6 7 8 9 10 Forward current IF (mA)
IF=5mA
30 I F= mA
20 IF=
Fig.8 Collector Current vs. Collector-emitter Voltage
Ta=25C
PC (MAX.)
200
150
100
mA
IF=10mA
50
Collector-emitter voltage VCE (V)
Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature
150 IF=5mA VCE=5V
Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature
0.16 Collector-emitter saturation voltage VCE (sat) (V) 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 -30 0 20 40 60 80 100 IF=20mA IC=1mA
Relative current transfer ratio (%)
100
50
0 -30
0
25
50
75
100
Ambient temperature Ta (C)
Ambient temperature Ta (C)
Fig.11 Collector Dark Current vs. Ambient Temperature
10-5
-6
Fig.12 Response Time vs. Load Resistance
1 000 VCE=2V IC=2mA Ta=25C 100 Response time (s)
VCE=50V
10 Collector dark current ICEO (A)
10
-7
tr 10 td 1 ts tf
10-8 10-9 10-10 10-11 -30
0
20
40
60
80
100
0.1 0.01
0.1
1 Load resistance (k)
10
100
Ambient temperature Ta (C)
Sheet No.: D2-A02904EN
8
PC123J00000F Series Fig.13 Test Circuit for Response Time Fig.14 Frequency Response
5 VCC Input RD RL Output Input Output Voltage gain Av (dB) 10% 90% td ts tr tf 0 VCE=5V IC=2mA Ta=25C
-5
VCE
-10 RL=10k -15 1k 100
Please refer to the conditions in Fig.12.
-20 0.1
1
10 Frequency (kHz)
100
1 000
Fig.15 Collector-emitter Saturation Voltage vs. Forward Current
Collector-emitter saturation voltage VCE (sat) (V) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 2 4 6 8 10 12 14 16 18 20 Forward current IF (mA) Ta=25C IC=0.5mA 1mA 3mA 5mA 7mA
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A02904EN
9
PC123J00000F Series Design Considerations Design guide
While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED.
Degradation
In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5years) into the design consideration.
Recommended Foot Print (reference) SMT Gullwing lead-form
8.2
Wide SMT Gullwing lead-form
10.2
2.54
2.54
1.7
2.2
2.2
1.7
(Unit : mm)
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A02904EN
10
PC123J00000F Series
Manufacturing Guidelines Soldering Method Reflow Soldering:
Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice.
(C) 300
Terminal : 260C peak ( package surface : 250C peak)
200
Reflow 220C or more, 60s or less 100 Preheat 150 to 180C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A02904EN
11
PC123J00000F Series Cleaning instructions Solvent cleaning:
Solvent temperature should be 45C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.
Presence of ODC
This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive. *Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).
Sheet No.: D2-A02904EN
12
PC123J00000F Series Package specification Sleeve package 1. Through-Hole Package materials
Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
520
2
6.7
5.8
10.8
(Unit : mm)
2. Wide Through-Hole Package materials
Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case.
Sleeve outline dimensions
15.0
520
2
6.35
5.9
10.8
(Unit : mm)
Sheet No.: D2-A02904EN
13
PC123J00000F Series Tape and Reel package 1. SMT Gullwing Package materials
Carrier tape : PS Cover tape : PET (three layer system) Reel : PS
Carrier tape structure and Dimensions
F E D G C I J
B H A H
Dimensions List A B 16.00.3 7.50.1 H I 0.1 10.4 0.400.05
C 1.750.10 J 4.20.1
D 8.00.1 K 5.10.1
E 2.00.1
(Unit : mm) F G +0.1 4.00.1 1.5-0.0
Reel structure and Dimensions
e g c d
f a b
Dimensions List a b 330 17.51.5 e f 231 2.00.5
5
K
X. MA
(Unit : mm) c d 1001 13.00.5 g 2.00.5
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A02904EN
14
PC123J00000F Series
2. Wide SMT Gullwing Package materials
Carrier tape : PS Cover tape : PET (three layer system) Reel : PS
Carrier tape structure and Dimensions
F E D G C I J
B H A K
Dimensions List A B 24.00.3 11.50.1 H I 12.40.1 0.400.05
C 1.750.10 J 4.10.1
D 8.00.1 K 5.10.1
E 2.00.1
(Unit : mm) F G +0.1 4.00.1 1.5-0.0
Reel structure and Dimensions
e g c d
f a b
Dimensions List a b 330 25.51.5 e f 231 2.00.5
5
M
. AX
H
(Unit : mm) c d 1 100 13.00.5 g 2.00.5
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Sheet No.: D2-A02904EN
15
PC123J00000F Series Important Notices
* The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication.
[E180]
Sheet No.: D2-A02904EN
16

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